NEW TECHNOLOGY IN VAPORISING SYSTEMS IS LAUNCHED |
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STEC has unveiled breakthrough technology in vaporising systems. An innovative direct liquid injection technology has enabled the company to develop ultra compact, high speed, low cost systems. STEC - part of the world-wide Horiba group - launched the VC and VS Series using the technology in Europe. Stuart Knight, Europe sales manager, says the new technology generates more reliable vaporisation than conventional buffer-type systems as it is unaffected by temperature or pressure. "At one fifth the size and half the cost of alternative systems, the new products are ultra compact and easily incorporated into existing processes, and the technology makes them ideally suited for the next generation of semiconductor materials," he said. "The new systems can vaporise liquid sources such as TEOS quickly and efficiently." The technology was developed in direct response to the growing use of organic metallic materials in production of minute and high-integrated semiconductors. STEC says the new systems are ideally suited for vaporisation of low pressure sources, such as Ba, Ta and Ti, that are difficult to process using conventional liquid vaporising methods. They are also suitable for semiconductor films such as LPCVD, MCVD, TEOS, TMPO, TMOA and TiCI4 as well as MOCVD such as TMG and TMA. The VC and VS use a piezo control valve to directly heat and vaporise the liquid source. VC is the non-carrier gas model while VS is the carrier gas inlet model. Simultaneous vaporisation and flow control by mass give a stable supply of various materials. Other benefits include flexibility in installation as the products maintain full functionality regardless of installation attitude. No bubbler or vapour tanks are required. |
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