Wafer Flatness Analysis System
SI-1200
Outline
The SI-1200 uses light
wavelengths to measure the flatness of 300mm wafers with a high
degree of precision (0.006 Žµm). In the measurement
process, a laser is significantly collimated, permeated through an
optical flat, and then irradiated onto the wafer surface. At that
time, the light reflected on the wafer surface creates interference
with the light reflected on the optical flat. This interference
registers on the unit's CCD display and the flatness of the wafer can
be determined from the interferometric data.
Main Features
The system supports 200mm and
300mm wafers.
Exceptionally simple phaser interference-type optoelectronic components are used.
Using the wavelength of light enables high-precision interferometry.
Adopting the fringe scanning method allows high precision measurement of up to 0.006 µm.
The system ships standard with an automated wafer transporter and a notch aligner.